Thermal simulation and characterization for the design of ultra-low power micro-hotplates on flexible substrate

Proceedings of IEEE Sensors

Volumn , Issue , 2008, Pages 74-77

  Courbat, Jérôme ^a   Canonica, Michael D ^a   Briand, Danick ^a   De Rooij, Nico F ^a   Teyssieux, Damien ^b   Thiery, Laurent ^b   Cretin, Bernard ^b  

^a UNIVERSITY OF NEUCHÂTEL   (Switzerland)

^b FEMTO ST INSTITUTE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DOWN-SCALING; FINITE ELEMENT SIMULATIONS; FLEXIBLE SENSOR; FLEXIBLE SUBSTRATE; HOT PLATES; LARGE SCALE PRODUCTIONS; LOW POWER; LOW POWER APPLICATION; MAIN PARAMETERS; MICROHOTPLATES; MICROMACHING; POLYIMIDE SUBSTRATE; POWER CONSUMPTION; PRINTING PROCESS; RFID APPLICATIONS; ROLL TO ROLL; SIMULATION MODEL; SMALL SCALE; THERMAL SIMULATIONS; THERMOGRAPHIC MEASUREMENT; ULTRA-LOW POWER; WIRELESS SENSORS NETWORKS;

ELECTRIC HEATING ELEMENTS; ELECTRIC POWER UTILIZATION; FLUIDIZED BED COMBUSTION; HAND HELD COMPUTERS; HEATING; POLYIMIDES; SENSOR NETWORKS; SENSORS; SIMULATORS; SUBSTRATES;

WIRELESS SENSOR NETWORKS;

EID: 67649977965     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSENS.2008.4716386     Document Type: Conference Paper

References (6)

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