Ultrasonic bonding for MEMS sealing and packaging

IEEE Transactions on Advanced Packaging

Volumn 32, Issue 2, 2009, Pages 461-467

  Kim, Jongbaeg ^a   Jeong, Bongwon ^a   Chiao, Mu ^b   Lin, Liwei ^c  

^a Yonsei University   (South Korea)

^b UNIVERSITY OF BRITISH COLUMBIA   (Canada)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Acoustics; Bonding; Glass; Hermetic sealing; Metals; Microelectromechanical devices; Micromachining; Packaging; Polymers; Silicon; Ultrasonic bonding

Indexed keywords

BONDING PROCESS; BONDING SURFACES; BONDING SYSTEMS; BONDING TOOLS; CRITICAL ISSUES; HERMETIC SEALING; LEAKAGE TESTS; LOW TEMPERATURE BONDING; LOW TEMPERATURES; MECHANICAL VIBRATIONS; MICROELECTROMECHANICAL SYSTEMS PACKAGING; MICROFLUIDIC CHIP; PRECLEANING; ROOM TEMPERATURE; SOLID-PHASE; TEMPERATURE LIMITATION; ULTRASONIC BONDING; WELDING PROCESS;

ALUMINUM; BIOCHIPS; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; DISSIMILAR MATERIALS; ELASTOMERS; GLASS; MEMS; MICROELECTROMECHANICAL DEVICES; MICROMACHINING; PLASTICITY; POLYMERS; SEALING (CLOSING); ULTRASONICS; VIBRATIONS (MECHANICAL);

GLASS BONDING;

EID: 67349094933     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.2009927     Document Type: Article

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