Wafer level packaging of micromachined gas sensors

IEEE Sensors Journal

Volumn 6, Issue 5, 2006, Pages 1232-1235

  Raible, Stefan ^b   Briand, Danick ^c   Kappler, Jürgen ^b   De Rooij, Nicolaas F ^a,c  

^a IEEE   (Switzerland)

^b AppliedSensor   (Germany)

^c UNIVERSITY OF NEUCHÂTEL   (Switzerland)

Author keywords

Gas sensor; Hotplate; Metal oxide; Packaging; Wafer level package

Indexed keywords

GAS-SENSING ELEMENTS; HOTPLATE; METAL OXIDE; WAFER LEVEL PACKAGING (WLP);

ELECTRONICS PACKAGING; GAS SENSING ELECTRODES; MICROMACHINING; SILICON WAFERS; THICK FILMS;

CHEMICAL SENSORS;

EID: 33749509176     PISSN: 1530437X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSEN.2006.881355     Document Type: Article

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