SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 37, Issue 10, 2008, Pages 1591-1597

Analysis and experimental verification of the volume effect in the reaction between zn-doped solders and cu

(4) Yang, S C a Wang, Y W a Chang, C C a Kao, C R a

a NATIONAL TAIWAN UNIVERSITY (Taiwan)

Author keywords

Diffusion; Intermetallics; Soldering

Indexed keywords

BULK SOLDERS; CU SUBSTRATES; DIFFUSION; EXPERIMENTAL VERIFICATION; INTERMETALLICS; REACTION PRODUCTS; REACTION TIME; SOLDER BALLS; SOLDER JOINTS; SOLDERING; VOLUME EFFECTS; ZN CONTENT;

BRAZING; CONCENTRATION (PROCESS); COPPER; COPPER ALLOYS; WELDING; ZINC;

SOLDERING ALLOYS;

EID: 51849128171 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0521-5 Document Type: Article

Times cited : (18)

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