The impact of annealing temperature and time on the electrical performance of Ti/Pt thin films

Applied Surface Science

Volumn 256, Issue 14, 2010, Pages 4564-4569

  Grosser, M ^a   Schmid, U ^b  

^a SAARLAND UNIVERSITY   (Germany)

^b VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

Author keywords

Diffusion; High temperature annealing; Platinum; Resistivity; Thin film

Indexed keywords

ANNEALING; DIFFUSION; ELECTRIC CONDUCTIVITY; FILM THICKNESS; GRAIN GROWTH; PLATINUM; PLATINUM COMPOUNDS; TITANIUM COMPOUNDS;

ANNEALING REGIMES; ANNEALING TEMPERATURES; ELECTRICAL BEHAVIORS; ELECTRICAL PERFORMANCE; FILM RESISTIVITY; HIGH-TEMPERATURE ANNEALING; MODERATE TEMPERATURE; ROOM-TEMPERATURE RESISTIVITY;

THIN FILMS;

EID: 77950596343     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2010.02.048     Document Type: Article

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