Investigation of high-temperature degradation of platinum thin films with an in situ resistance measurement apparatus

Journal of Microelectromechanical Systems

Volumn 7, Issue 1, 1998, Pages 128-135

  Firebaugh, Samara L ^a,b,g   Jensen, Klavs F ^a,c,d,e   Schmidt, Martin A ^a,f,g  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

^b PRINCETON UNIVERSITY   (United States)

^c TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

^d UNIVERSITY OF WISCONSIN MADISON   (United States)

^e Massachusetts Institute of Technology   (United States)

^f RENSSELAER POLYTECHNIC INSTITUTE   (United States)

^g IEEE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; HIGH TEMPERATURE EFFECTS; HIGH TEMPERATURE OPERATIONS; METALLIZING; MICROELECTROMECHANICAL DEVICES; PLATINUM; SCANNING ELECTRON MICROSCOPY;

TEMPERATURE RESISTANCE; TEMPERATURE WAFER CURVATURE MEASUREMENTS;

THIN FILMS;

EID: 0032023866     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/84.661395     Document Type: Article

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