Influence of thermal annealing on the resistivity of titanium/platinum thin films

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 24, Issue 6, 2006, Pages 2139-2146

  Schmid, U ^a   Seidel, H ^a  

^a SAARLAND UNIVERSITY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ANNEALING; DIFFUSION; ELECTRIC CONDUCTIVITY; PLASTIC DEFORMATION; SILICON WAFERS;

ANNEALING TEMPERATURES; BILAYER SYSTEMS; THERMAL ANNEALING;

THIN FILMS;

EID: 33750941749     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.2359739     Document Type: Article

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