Experiment and numerical analysis of the residual stresses in underfill resins for flip chip package applications

Journal of Electronic Packaging

Volumn 127, Issue 1, 2005, Pages 47-51

  Sham, Man Lung ^a   Kim, Jang Kyo ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Bi Material Strip Bending (BMSB); Finite Element Method; Residual Stress; Underfill Resins

Indexed keywords

BENDING (DEFORMATION); BENDING STRENGTH; BISMUTH; COOLING; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; RESIDUAL STRESSES;

BI-MATERIAL STRIP BENDING (BMSB); ELECTRONIC PACKAGE COMPONENTS; TELESCOPIC METHOD; UNDERFILL RESINS;

RESINS;

EID: 18744391397     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1849232     Document Type: Article

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