Effects of Ga, Al, Ag, and Ce multi-additions on the properties of Sn-9Zn lead-free solder

Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 2, 2010, Pages 111-119

  Wang, Hui ^a   Xue, Songbai ^a   Zhao, Feng ^b   Chen, Wenxue ^a  

^a NANJING UNIVERSITY OF AERONAUTICS AND ASTRONAUTICS   (China)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM OXIDE FILMS; CU SUBSTRATE; DISPERSION STRENGTHENING; INTERMETALLIC COMPOUNDS; LEAD FREE SOLDERS; SEM; SOLDERABILITY; WETTING BALANCE METHODS; XRD ANALYSIS;

AGGLOMERATION; ALUMINUM; AUGER ELECTRON SPECTROSCOPY; CERIUM; CERIUM COMPOUNDS; GALLIUM; INTERMETALLICS; LEAD; MECHANICAL PROPERTIES; OXIDE FILMS; SILVER; SOLDERING ALLOYS; SURFACE PROPERTIES; SURFACE TENSION; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY; ZINC;

TIN;

EID: 77949273954     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-9877-4     Document Type: Article

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