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Materials Transactions

Volumn 45, Issue 3, 2004, Pages 776-782

Microstructures, thermal and tensile properties of Sn-Zn-Ga alloys

(3) Song, Jenn Ming a Liu, Nai Shuo a Lin, Kwang Lung a

a NATIONAL CHENG KUNG UNIVERSITY (Taiwan)

Author keywords

Lead free solder; Mechanical properties; Microstructure; Thermal behavior; Tin zinc gallium

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; DUCTILITY; EUTECTICS; MELTING; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SOLDERING; SOLDERING ALLOYS; SOLIDIFICATION; THERMAL EFFECTS; THERMOCOUPLES; WETTING;

LEAD-FREE SOLDER; THERMAL BEHAVIOR; TIN-ZINC-GALLIUM; WETTABILITY;

TIN ALLOYS;

EID: 2442604458 PISSN: 13459678 EISSN: None Source Type: Journal
DOI: 10.2320/matertrans.45.776 Document Type: Article

Times cited : (17)

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