Phase equilibria and thermodynamic properties of Sn-Ag based Pb-free solder alloys

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 26, Issue 1, 2003, Pages 84-89

  Ohnuma, Ikuo ^a   Miyashita, Masamitsu ^a   Liu, Xing Jun ^a   Ohtani, Hiroshi ^b   Ishida, Kiyohito ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b KYUSHU INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

CALPHAD; Micro solder alloy; Phase equilibria; Thermodynamic database

Indexed keywords

COMPUTER SIMULATION; DATABASE SYSTEMS; PHASE DIAGRAMS; PHASE EQUILIBRIA; SOLDERING ALLOYS; SOLIDIFICATION; SURFACE TENSION; THERMODYNAMIC PROPERTIES; TIN ALLOYS; VISCOSITY OF LIQUIDS;

ALLOY DATABASE FOR MICRO-SOLDERS; CALCULATION OF PHASE DIAGRAMS METHOD; MICRO-SOLDER ALLOY;

ELECTRONICS PACKAGING;

EID: 0038112030     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2003.813003     Document Type: Article

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