The wetting of copper by Al-Zn-Sn solders

Journal of Materials Science: Materials in Electronics

Volumn 9, Issue 1, 1998, Pages 5-8

  Lin, Kwang Lung ^a   Wen, Li Hsiang ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM ALLOYS; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; TERNARY SYSTEMS; WETTING;

COPPER WETTING TIMES;

COPPER;

EID: 0031999966     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1008816212811     Document Type: Article

References (10)

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