Wetting interaction between Sn-Zn-Ag solders and Cu

Journal of Electronic Materials

Volumn 32, Issue 2, 2003, Pages 95-100

  Lin, Kwang Lung ^a   Shih, Chia Ling ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Intermetallic compound; Pb free solder; Sn Zn Ag; Wetting

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; EUTECTICS; INTERDIFFUSION (SOLIDS); INTERFACES (MATERIALS); INTERMETALLICS; SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; TIN ALLOYS; X RAY DIFFRACTION ANALYSIS;

LEAD-FREE SOLDERS;

WETTING;

EID: 0037326635     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0242-8     Document Type: Article

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