Thermal management for stacked 3D microelectronic packages

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn 2005, Issue , 2005, Pages 1761-1766

  Popova, N ^a   Schaeffer, Ch ^a   Sarno, C ^b   Parbaud, S ^b   Kapelski, G ^c  

^a LABORATOIRE D ELECTROTECHNIQUE DE GRENOBLE   (France)

^b THALES AVIONICS   (France)

^c Grenoble INP Phelma   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC STRUCTURE; ELECTRONICS PACKAGING; MICROELECTRONICS; THREE DIMENSIONAL COMPUTER GRAPHICS;

MICROELECTRONIC PACKAGES; MULTIFUNCTIONAL ELECTRONIC PACKAGES;

TEMPERATURE CONTROL;

EID: 33847759792     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2005.1581869     Document Type: Conference Paper

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6. th THERMINIC Workshop, 1-4 October 2002, Madrid.
7. Y. Avenas, M. Ivanova, N. Popova, C. Schaeffer, "Thermal analysis of thermal spreaders used in power electronics cooling".