Theoretical investigation of sub-ambient on-chip microprocessor cooling

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2006, Issue , 2006, Pages 765-770

  Jain, Ankur ^a,b   Ramanathan, Shriram ^a,c  

^a INTEL CORPORATION   (United States)

^b STANFORD UNIVERSITY   (United States)

^c HARVARD UNIVERSITY   (United States)

Author keywords

Heat dissipation; Microprocessor; Pulse tube cooling; Refrigeration; Stirling cycle; Sub ambient cooling; Thermal management

Indexed keywords

COOLING; ELECTRIC POWER UTILIZATION; HEAT LOSSES; REFRIGERATION; STIRLING CYCLE;

HEAT LOADS; PULSE TUBE COOLING; SUB-AMBIENT COOLING; THERMAL MANAGEMENT;

MICROPROCESSOR CHIPS;

EID: 33845598094     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2006.1645423     Document Type: Conference Paper

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