Power distribution measurements of the dual core PowerPC™ 970MP microprocessor

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn , Issue , 2006, Pages

  Hamann, Hendrik F ^a   Weger, Alan ^a   Lacey, James ^a   Cohen, Erwin ^b   Atherton, Craig ^b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

OPERATING CONDITIONS; POWER DISTRIBUTION MEASUREMENTS; SPATIALLY-RESOLVED IMAGING OF MICROPROCESSOR POWER (SIMP);

ELECTRIC LOAD DISTRIBUTION; ELECTRIC POWER MEASUREMENT; IMAGE ANALYSIS; TEMPERATURE MEASUREMENT;

MICROPROCESSOR CHIPS;

EID: 39749087049     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)