Hierarchically nested channels for fast squeezing interfaces with reduced thermal resistance

IEEE Transactions on Components and Packaging Technologies

Volumn 30, Issue 2, 2007, Pages 226-234

  Brunschwiler, Thomas ^a   Kloter, Urs ^a   Linderman, Ryan J ^a   Rothuizen, Hugo ^a   Michel, Bruno ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

Author keywords

Bondline thickness (BLT); Fluid flow; Interface; Interface aging; Microchannel; Packaging; Thermal interface material (TIM); Thermal management; Thermal resistance; Viscosity

Indexed keywords

FLIP CHIP DEVICES; FLOW OF FLUIDS; HEAT RESISTANCE; INTERFACES (MATERIALS); MICROCHANNELS; NEWTONIAN LIQUIDS; PRESSURE GRADIENT; TEMPERATURE CONTROL; THERMAL CONDUCTIVITY; VISCOSITY;

BONDLINE THICKNESS; CHANNEL ARRAY; THERMAL INTERFACE MATERIAL;

ELECTRONICS PACKAGING;

EID: 34249902507     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2007.897991     Document Type: Article

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