Thermal issues in stacked die packages

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2005, Pages 307-312

  Rencz, Marta ^a,b  

^a MicReD Ltd   (Hungary)

^b BUDAPEST UNIVERSITY OF TECHNOLOGY AND ECONOMICS   (Hungary)

Author keywords

Dies attach qualification; Package thermal qualification; Stacked dies; Thermal transient measurements

Indexed keywords

DIES ATTACH QUALIFICATION; PACKAGE THERMAL QUALIFICATION; STACKED DIES; THERMAL TRANSIENT MEASUREMENTS;

FAILURE ANALYSIS; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR MATERIALS; THERMAL EFFECTS; THERMAL VARIABLES MEASUREMENT;

DIES;

EID: 28144459360     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/STHERM.2005.1412197     Document Type: Conference Paper

References (24)

1. Stephane Pinel, Antoine Marty, Josiane Tasselli, Jean-Pierre Bailbe, Eric Beyne, Rita Van Hoof, Santiago Marco, Joan Ramon Morante, Olivier Vendier, Marc Huan: Thermal Modeling and Management in Ultrathin Chip Stack Technology, IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 2, June 2002
2. Charles W.C. Lin, Sam C.L. Chiang, T.K. Andrew Yang: 3D Stacked Packages With Bumpless Interconnect Technology, 2003 IEEE/CPMT/SEMI Int'l Electronics Manufacturing Technology Symposium
3. Jon Brunner, Ivy Wei Qin, Bob Chylak: Advanced Wire Bond Looping Technology for Emerging Packages. 2004 IEEE/SEMI Int'l Electronics Manufacturing Technology Symposium, pp. 85-90
4. R. Fillion, R. Wojnarowski, C. Kapusta, R. Saia, K. Kwiatkowski, J. Lyke: Advanced 3-D Stacked Technology, 2003 Electronics Packaging Technology Conference
5. S. Krishnamoorthi, D. Y. R. Chong, A.Y.S. Sun: Thermal management and characterization of flip chip BGA packages, EPTC 2004, 8-11 December, Singapore, Proceedings pp 53-59
6. th SEMI-THERM Symposium, in this issue
7. th IEEE SEMI-THERM Symposium, pp. 160-167
8. Li Zhang, Noella Howard, Vijaylaxmi Gumaste, Amindya Poddar, Luu Nguyen: Thermal Characterization of Stacked-Die Packages, 20th IEEE SEMI-THERM Symposium, pp. 55-63
9. th IEEE SEMI-THERM Symposium, in this issue
10. th SEMI-THERM Symposium, in this issue
11. A. Gowda, D. Esler, S. Tonapi: Voids in thermal interface Material Layers and their effect on thermal performance, EPTC 2004, 8-11 December, Singapore, Proceedings pp 41-46
12. M. Rencz, V. Székely: Structure function evaluation of stacked dies, Proceedings of the XXth SEMI-THERM Symposium, March 9-11, 2004, San Jose, CA, USA, pp 50-55.
13. M. Rencz, V. Székely, B. Courtois, L. Zhang, N. Howard, L. Nguyen: Die attach quality control of 3D stacked dies, Proceeding of the IEMT Symposium of SEMICON West, San Jose, Jul 12-16, CA, USA, 2004, Proceedings pp 78-84.
14. M. Rencz, V. Székely, A. Poppe, B. Courtois, L. Zhang, N. Howard, L. Nguyen: Testing the die attach quality of 3D stacked dies, Proceedings of IMECE2004, ASME International Mechanical Engineering Congress, Nov. 13-19 2004, Anaheim, Ca, USA
15. V. Székely and Tran Van Bien: "Fine structure of heat flow path in semiconductor devices: a measurement and identification method", Solid-State Electronics, V.31, pp. 1363-1368 (1988)
16. M. Rencz, V. Székely, A. Morelli, C. Villa: Determining partial thermal resistances with transient measurements and using the method to detect die attach discontinuities, Proceedings of the XVIIIth SEMI-THERM Symposium, March 1-14 2002, San Jose, CA, USA pp 15-20
17. http://www.delphi.com/pdf/techpapers/2004-01-1681.pdf
18. www.micred.com/t3ster.html
19. th SEMI-THERM Symposium, in this issue
20. B.Guenin: Thermal calculations for multi-chip modules, Electronics Cooling, Vol 8, No.4, 2002
21. C.J.M. Lasance, D. den Hertog, P. Stehouwer: "Creation and evaluation of compact models for thermal characterisation using dedicated optimisation software", SEMI-THERM'99, 9-11 March, 1998, San Diego, USA, Proceedings pp. 189-200
22. H. Pape, G. Noebauer: "Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods", SEMI-THERM'99, 9-11 March, 1998, San Diego, USA, Proceedings pp.201-211
23. M. Rencz, A. Poppe, E. Kollár, S. Ress, V. Székely, B. Courtois: A procedure to correct the error in the structure function based thermal measuring methods, Proceedings of the XXth SEMI-THERM Symposium, March 9-11, 2004, San Jose, CA, USA, pp 92-98
24. th SEMI-THERM Symposium, 11-13 March 2003, San Jose, USA, Proceedings pp 290-299