A Statistical Polishing Pad Model for Chemical-Mechanical Polishing

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 1993, Pages 865-868

  Yu, Tat Kwan ^a   Yu, Chris C ^a   Orlowski, Marius ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

SURFACE ROUGHNESS; CHEMICAL POLISHING; MATHEMATICAL MODELS; ROUGHNESS MEASUREMENT; SEMICONDUCTOR DEVICE MANUFACTURE; STATISTICAL METHODS;

ASPERITY MODEL; CHEMICAL MECHANICAL POLISHING MODELS; CRITICAL TECHNOLOGIES; DYNAMIC INTERACTION; INTEGRATED CIRCUIT FABRICATION; MECHANISM-BASED; PAD MODELS; POLISHING MECHANISM; POLISHING PADS; WAFER CONTACTS;

CHEMICAL MECHANICAL POLISHING; INTEGRATED CIRCUITS;

ASPERITY DEVICE INTERACTION; CHEMICAL MECHANICAL POLISHING (CMP); DYNAMIC INTERACTION; POLISHING PAD MODEL;

EID: 0027889065     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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