Optical interferometry for surface measurements of CMP pads

Journal of Electronic Materials

Volumn 25, Issue 10, 1996, Pages 1623-1627

  Stein, David ^a   Hetherington, Dale ^b   Dugger, Mike ^b   Stout, Tom ^c  

^a University of New Mexico   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

^c WYKO Corporation   (United States)

Author keywords

Chemical mechanical polishing; Optical interferometry; Oxide films; Surface morphology

Indexed keywords

EID: 0001126981     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02655586     Document Type: Article

References (5)

1. P. Singer, Semiconductor International 48, February (1994).
2. I. Ali, S.R. Roy, G. Shinn and C. Tipton, 1995 DUM1C Conf. PTOC. (VMIC, 1995).
3. T. Yu, C. Yu and M. Orlowski, Conf. Proc. ULSI-X (Pittsburgh, PA: Mater. Res. Soc., 1995).
4. WYKO Corporation technical documentation.
5. L.M. Cook, J. Non-Crystalline Solids 120, 152 (1990).