Investigation of pad surface topography distribution for material removal uniformity in CMP process

Journal of the Electrochemical Society

Volumn 155, Issue 8, 2008, Pages

  Park, Kihyun ^a   Jeong, Haedo ^a  

^a Pusan National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DIAMONDS; DISKS (STRUCTURAL COMPONENTS); ENGINEERING GEOLOGY; FRICTION; GRINDING (MACHINING); MACHINE VIBRATIONS; NANOTECHNOLOGY; RANDOM PROCESSES; STANDARDS; STATISTICS; STEEL ANALYSIS; SURFACE PROPERTIES; SURFACE ROUGHNESS; SURFACES; TOPOGRAPHY;

(1 1 0) SURFACE; CHEMICAL-MECHANICAL PLANARIZATION (CMP) PROCESSES; CMP PROCESSES; DIAMOND DISKS; DIFFERENT TYPES; ELECTROCHEMICAL SOCIETY (ECS); HIGH REMOVAL RATES; INTER LAYER DIELECTRIC (ILD); MATERIAL REMOVAL RATE (MRR); MATERIAL REMOVALS; PAD SURFACE; RANDOM ROUGHNESS; REAL CONTACT AREA; STANDARD DEVIATION (STD); SURFACE LAYERING; TWO TYPES; UNIFOR M DISTRIBUTION;

SURFACE TOPOGRAPHY;

EID: 46649121513     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2938378     Document Type: Article

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