Mechanical fatigue analysis of gold microbeams for RF-MEMS applications by pull-in voltage monitoring

Analog Integrated Circuits and Signal Processing

Volumn 61, Issue 3, 2009, Pages 215-222

  De Pasquale, G ^a   Soma A ^a   Ballestra, A ^a  

^a POLITECNICO DI TORINO   (Italy)

Author keywords

Failure analysis; Fatigue; Gold; MEMS; Reliability

Indexed keywords

ACTUATION VOLTAGES; EXCITATION FREQUENCY; FATIGUE; FATIGUE EFFECTS; FATIGUE LIMIT; MATERIAL DEGRADATION; MECHANICAL FATIGUE; MECHANICAL STRENGTH; MICRO BEAMS; MICRO-CANTILEVERS; NOVEL TECHNIQUES; NUMBER OF CYCLES; NUMBER OF CYCLES TO FAILURE; PULL-IN VOLTAGE; RF-MEMS; STAIR-CASE; VIBRATION AMPLITUDE;

ELECTRONIC EQUIPMENT TESTING; FAILURE ANALYSIS; GOLD; MEMS; MICROELECTROMECHANICAL DEVICES; RELIABILITY ANALYSIS; SAFETY FACTOR;

QUALITY ASSURANCE;

EID: 70350091573     PISSN: 09251030     EISSN: 15731979     Source Type: Journal    
DOI: 10.1007/s10470-009-9295-9     Document Type: Article

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