Modular parametric finite element modelling for reliability-studies in electronic and mems packaging

Microsystem Technologies

Volumn 10, Issue 5, 2004, Pages 375-381

  Wunderle, B ^a   Auersperg, J ^a,b   Grosser V ^a   Kaulfersch, E ^a,b   Wittler, O ^c   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

^b AMIC Angewandte Micro Messtechnik GmbH   (Germany)

^c TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MICROELECTROMECHANICAL DEVICES; MICROELECTRONICS; OPTIMIZATION; RELIABILITY; SOLDERED JOINTS; THERMOMECHANICAL TREATMENT;

MEMS PACKAGING; PREDICTIVE ENGINEERING; THERMAL MANAGEMENT; THERMO-MECHANICAL FATIGUE;

ELECTRONICS PACKAGING;

EID: 4644338668     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-004-0426-z     Document Type: Conference Paper

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