Stress characterization of electroplated gold layers for low temperature surface micromachining

DTIP 2003 - Design, Test, Integration and Packaging of MEMS/MOEMS 2003

Volumn , Issue , 2003, Pages 402-405

  Margesin, B ^a   Bagolini, A ^a   Guarnieri, V ^a   Giacomozzi, F ^a   Faes, A ^a   Pal, R ^b   Decarli, M ^b  

^a ITC IRST   (Italy)

^b UNIVERSITY OF TRENTO   (Italy)

Author keywords

Compressive stress; Current density; Gold; Internal stresses; Micromachining; Rough surfaces; Surface roughness; Temperature; Tensile stress; Thermal stresses

Indexed keywords

EID: 84945921052     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/DTIP.2003.1287077     Document Type: Conference Paper

References (10)

1. G. G. Stoney: Proc. R. Soc. London, Ser, A 82, 172 (1909).
2. R.W.Hoffmann, "measurement techniques for thin films", Electrochem. Soc. Inc. NY, 312 (1967).
3. R.C.Cammarata and T.M.Trimble, "Surface stress model for intrinsic stresses in thin films", J.Mat.Res., Vol.15, No.11, pp.2468-2471, Nov.2000.
4. W.J.Dauksher, D.J.Resnick et al.: "A new Operating Regime for Electroplating the Gold Absorber on X-Ray masks", Microelectronic Engineering 23, pp235-238 (1994) Elsevier.
5. W.Chu, M.L.Schattenburg, H.I.Smith: "Low Stress Gold Electroplating for X-Ray Masks", Microelectronic Engineering 17, pp223-226 (1992) Elsevier
6. P.H. Lawyer and C.H.Fields: "Film Stress versus Plating Rate fir Pulse-Plated Gold", HRL Laboratories, LLC, 3011 Malibu, CA 90265, 2001.
7. H. Watanabe, S. Hayashi et al.:"Microbump Formation by Noncyanide Gold Electroplating", Journal of The Electrochemical Society 146(2), pp574-579 (1999) The Electrochemical Society.
8. M. A. George, W. S. Glaunsinger et al.: "Electrical, Spectroscopic and Morphological Investigation of Chromium Diffusion through Gold Films", Thin Solid Films, 189, pp 59-72, 1990.
9. V. Guarnieri, R. Pal, A. Bagolini et al.: "Cr/Ni/Au multilayer films for high temperature MEMS applications" abstracts of the Therminic 2002 workshop, 2002.
10. Shyam P. Murarka: "Metallization Theory and Practice for VLSI and ULSI", pp65, Butterworth-Heinemann, USA, 1993.