Fatigue damage evolution in silicon films for micromechanical applications

Experimental Mechanics

Volumn 43, Issue 3, 2003, Pages 289-302

  Shrotriya, P ^a   Allameh, S ^a   Brown, S ^b   Suo, Z ^a   Soboyejo, W O ^a  

^a Princeton University   (United States)

^b Exponent Failure Analysis Associates   (United States)

Author keywords

Crack growth; Fatigue; MEMS; Polysilicon; Surface topography evolution

Indexed keywords

CRACK INITIATION; FATIGUE OF MATERIALS; FRACTURE TOUGHNESS; MICROELECTROMECHANICAL DEVICES; PERTURBATION TECHNIQUES; STRESS CORROSION CRACKING; TOPOLOGY;

CYCLIC FATIGUE;

POLYSILANES;

ACTUATOR; CRACK PROPAGATION; FATIGUE; MICROELECTROMECHANICAL SYSTEM; SURFACE ROUGHNESS;

EID: 0141940247     PISSN: 00144851     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02410527     Document Type: Article

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