Direct fabrication of integrated 3D Au nanobox arrays by sidewall deposition with controllable heights and thicknesses

Nanotechnology

Volumn 20, Issue 39, 2009, Pages

  Cha, Nam Goo ^a   Lee, Bong Kuk ^a   Kanki, Teruo ^a   Lee, Hea Yeon ^a   Kawai, Tomoji ^a   Tanaka, Hidekazu ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BI-LAYER; BOTTOM LAYERS; CLEANING PROCESS; DEPOSITION TIME; DRY DEPOSITION TECHNIQUE; FABRICATION METHOD; GEOMETRIC EFFECTS; HIGH REPRODUCIBILITY; HOLLOW NANOSTRUCTURES; ION MILLING; NANO-IMPRINT; NANO-METER SCALE; NANO-PILLAR ARRAYS; NANOBOXES; PATTERNED MOLDS; RESOLUTION LIMITS; SCANNING ELECTRON MICROSCOPE; SEM; SPUTTERING METHODS;

CHEMICAL VAPOR DEPOSITION; DEPOSITION; FABRICATION; FUNCTIONAL MATERIALS; GOLD; MOLDS; NANOIMPRINT LITHOGRAPHY; NANOSTRUCTURES; PULSED LASER DEPOSITION; SCANNING ELECTRON MICROSCOPY; THREE DIMENSIONAL;

REACTIVE ION ETCHING;

GOLD; NANOMATERIAL;

ARTICLE; DRY DEPOSITION; GEOMETRY; MATERIAL COATING; NANOARRAY; NANOFABRICATION; PARTICLE SIZE; PRIORITY JOURNAL; REPRODUCIBILITY; SIDEWALL DEPOSITION; TECHNIQUE; THICKNESS;

EID: 70349157263     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/20/39/395301     Document Type: Article

References (30)

1. Currall S C, King E B, Lane N, Madera J and Turner S 2006 Nat. Nanotechnol. 1 153
2. Bao Z, Weatherspoon M R, Shian S, Cai Y, Graham P D, Allan S M, Ahmad G, Dickerson M B, Church B C and Kang Z 2007 Nature 446 172
3. Qi M, Lidorikis E, Rakich P T, Johnson S G, Joannopoulos J D, Ippen E P and Smith H I 2004 Nature 429 538
4. El-Ali J, Sorger P K and Jensen K F 2006 Nature 442 27
5. Kim D H, Ahn J H, Choi W M, Kim H S, Kim T H, Song J, Huang Y Y, Liu Z, Lu C and Rogers J A 2008 Science 320 507
6. Casta F J, Ross C A, Frandsen C, Eilez A, Gil D, Smith H I, Redjdal M and Humphrey F B 2003 Phys. Rev. B 67 184425
7. Chen D C, Yao Y D, Wu J K, Yu C and Lee S F 2008 J. Appl. Phys. 103 07F312
8. Han X F, Wen Z C and Wei H X 2008 J. Appl. Phys. 103 07E933
9. Chappert C, Fert A and Van Dau F N 2007 Nat. Mater. 6 813
10. Hara M, Kimura T and Otani Y 2008 Physica E 40 1108
11. Wen Z C, Wei H X and Han X F 2007 Appl. Phys. Lett. 91 122511
12. Mijatovic D, Eijkel J C T and Berg A 2005 Lab Chip 5 492
13. Matsui S 2006 Microsc. Microanal. 12 130
14. Li R W, Kanki T, Tohyama H A, Hirooka M, Tanaka H and Kawai T 2005 Nanotechnology 16 28
15. Vieu C, Carcenac F, Pepin A, Chen Y, Mejias M, Lebib A, Manin-Ferlazzo L, Couraud L and Launois H 2000 Appl. Surf. Sci. 164 111
16. Ansari K, Van Kan J A, Bettiol A A and Watt F 2004 Appl. Phys. Lett. 85 476
17. Zhao X M, Xia Y and Whitesides G M 1997 J. Mater. Chem. 7 1069
18. Zaumseil J, Meitl M A, Hsu J W P, Acharya B R, Baldwin KW, Loo Y L and Rogers J A 2003 Nano Lett. 3 1223
19. Chou S Y, Krauss P R and Renstrom P J 1995 Appl. Phys. Lett. 67 3114
20. Chou S Y, Krauss P R, Zhang W, Guo L and Zhuang L 1997 J. Vac. Sci. Technol. B 15 2897
21. Austin M D, Ge H, Wu W, Li M, Yu Z, Wasserman D, Lyon SA and Chou S Y 2004 Appl. Phys. Lett. 84 5299
22. Schmitt H, Frey L, Ryssel H, Rommel M and Lehrer C 2007 J. Vac. Sci. Technol. B 25 785
23. Harriott L R 2001 Proc. IEEE 89 366
24. Hsu D S Y, Turner N H, Pierson K W and Shamamian V A 1992 J. Vac. Sci. Technol. B 10 2251
25. Liang X, Morton K J, Austin R H and Chou S Y 2007 Nano Lett. 7 3774
26. Choi Y K, King T J and Hu C 2002 IEEE Electron. Device Lett. 23 25
27. Choi Y K, Zhu J, Grunes J, Bokor J and Somorjai G A 2003 J. Phys. Chem. B 107 3340
28. Li Q and Penner R M 2005 Nano Lett. 5 1720
29. Cha N G and Park J G 2006 Nanomanufacturing Handbook ed A A Busnaina (New York: CRC Press) p183
30. Bär E, Lorenz J and Ryssel H 2002 Microelectron. Eng. 64 321