Modeling of Ag3Sn coarsening and its effect on creep in Sn-Ag-Cu solder

Jinshu Xuebao/ Acta Metallurgica Sinica

Volumn 45, Issue 8, 2009, Pages 912-918

  Wang, Xiaojing ^a   Zhu, Qingsheng ^a   Wang, Zhongguang ^a   Shang, Jianku ^a,b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b United States of America   (United States)

Author keywords

Electric current; Particle coarsening; Pb free solder

Indexed keywords

CREEP MODEL; CURRENT-STRESSING; EUTECTIC MICROSTRUCTURE; HYDROSTATIC CONSTRAINT; LEAD-FREE SOLDER ALLOY; PARTICLE COARSENING; PB-FREE SOLDER; SECOND PHASE PARTICLES; SN-AG-CU; SNAGCU SOLDER; SOLDER JOINTS;

CREEP; ELECTRIC CURRENT MEASUREMENT; ELECTRIC CURRENTS; ELECTRIC POWER SUPPLIES TO APPARATUS; LEAD; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; STRAIN; TIN; TIN ALLOYS;

COARSENING;

EID: 70249125836     PISSN: 04121961     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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