Electromigration induced strain field simulations for nanoelectronics lead-free solder joints

International Journal of Solids and Structures

Volumn 44, Issue 14-15, 2007, Pages 4909-4924

  Basaran, Cemal ^a   Lin, Minghui ^a  

^a State University of New York   (United States)

Author keywords

Current crowding; Electromigration; Finite element method; Nanoelectronics packaging; Thermomigration; Viscoplasticity

Indexed keywords

ELECTROMIGRATION; ELECTRONICS PACKAGING; FAILURE ANALYSIS; FINITE ELEMENT METHOD; LEAD; NANOELECTRONICS; STRAIN ENERGY; VISCOPLASTICITY;

CURRENT CROWDING; ELECTROMIGRATION FAILURE; NANOELECTRONICS PACKAGING; STRAIN FIELD; THERMOMIGRATION;

SOLDERED JOINTS;

EID: 33947621099     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2006.12.011     Document Type: Article

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