Microstructure coarsening during static annealing of 60Sn40Pb solder joints: III intermetallic compound growth kinetics

Journal of Electronic Materials

Volumn 30, Issue 10, 2001, Pages 1308-1312

  Jung, K ^a   Conrad, H ^a  

^a North Carolina State University   (United States)

Author keywords

Activation energy; Cu3Sn; Cu6Sn5; Diffusion; Intermetallic compound

Indexed keywords

ANNEALING; DIFFUSION; INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; PHASE INTERFACES; TIN ALLOYS;

MICROSTRUCTURE COARSENING;

SOLDERED JOINTS;

EID: 0035485064     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0116-x     Document Type: Article

References (17)