Formation of bulk intermetallic compound Ag3Sn in slowly-cooled lead-free Sn-4.0 wt pct Ag solders

Journal of Materials Science and Technology

Volumn 21, Issue 6, 2005, Pages 827-830

  Shen, Jun ^a   Liu, Yongchang ^a   Han, Yajing ^a   Zhang, Peizhen ^a   Gao, Houxiu ^a  

^a TIANJIN UNIVERSITY   (China)

Author keywords

Intermetallic compounds; Lead free solder; Microstructure; Thermal analysis

Indexed keywords

COOLING; HARDNESS; INTERMETALLICS; LEAD; MEASUREMENTS; MICROSTRUCTURE; SILVER ALLOYS; THERMOANALYSIS; TIN ALLOYS;

COOLING RATE; INTERMETALLIC COMPOUNDS (IMCS); LEAD-FREE SOLDER; THERMAL ANALYSIS;

SOLDERING ALLOYS;

EID: 31844433262     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

1. K.Suganuma, K.Niihara, T.Morito and Y.Nakamura: J. Jpn. Inst. Interconnection Packaging Electron Circuits, 1997, 12, 406.
2. K.Suganuma, S.H.Huh, K.S.Kim, H.Nakase and Y.Nakamura: Mater. T. JIM., 2001, 42, 286.
3. K.S.Kim, S.H.Huh and K.Suganuma: Mater. Sci. Eng., 2002. A333, 106.
4. K.S.Kim, S.H.Huh and K.Suganuma: J. Alloy. Compd., 2003. 352, 226.
5. F.Ochoa, J.J.Williams and N.Chawla: JOM, 2003, 55, 56.
6. F.Ochoa, J.J.Williams and N.Chawla: J. Electron Mater., 2003, 32, 1414.
7. P.Y.Chevalier: Thermochim. Acta, 1988, 136, 45.
8. A.T.W.Kempen, F.Sommer and E.J.Mittemeijer: Thermochim. Acta, 2002, 382, 21.
9. G.F.Vander Voort: Metallography Principles and Practice, McGraw-Hill, New York, 1984.
10. M.Koruda, D.Setoyama, M.Uno and S.Yamanaka: J. Alloy. Compd., 2004, 368, 211.
11. Y.C.Liu, F.Sommer and E.J.Mittemeijer: Acta Mater., 2003, 51, 507.
12. X.Deng, N.Chawla, K.K.Chawla and M.Koopman: Acta Mater., 2004, 52, 4291.