Effect of thermal-shearing cycling on Ag3Sn microstructural coarsening in SnAgCu solder

Journal of Alloys and Compounds

Volumn 469, Issue 1-2, 2009, Pages 102-107

  Qi, Lihua ^a   Huang, Jihua ^a   Zhao, Xingke ^a   Zhang, Hua ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Ag3Sn IMC; Coarsening kinetic; Formation mechanism; Microstructure

Indexed keywords

BRAZING; COARSENING; COPPER; INTERMETALLICS; LEAD; LEAD COMPOUNDS; MICROSTRUCTURE; SEMICONDUCTING INTERMETALLICS; SHEARING; SILVER; SOLDERING ALLOYS; STRAIN RATE; WELDING;

AG3SN IMC; CYCLING CONDITIONS; CYCLING PROCESSES; FORMATION MECHANISM; INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDERS; MICROSTRUCTURAL COARSENING; SN PARTICLES; SNAGCU SOLDERS; SOLDER JOINTS; STRESS STRAINS;

TIN;

EID: 58249133405     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2008.01.108     Document Type: Review

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