Microstructurally based finite element simulation of solder joint behaviour

Soldering and Surface Mount Technology

Volumn , Issue 25, 1997, Pages 39-42

  Frear, D R ^a   Burchett, S N ^a   Neilsen, M K ^a   Stephens, J J ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; CREEP TESTING; ELECTRONICS PACKAGING; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MELTING; MICROSTRUCTURE; SOLDERING ALLOYS; THERMOMECHANICAL TREATMENT; VISCOPLASTICITY; WETTING;

CYCLIC STRAIN; THERMOMECHANICAL FATIGUE;

SOLDERED JOINTS;

EID: 0031070014     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

1. Frear, D. R., 'Microstruclural Evolution During the Thermomechanical Fatigue of Solder Joints', in 'The Metal Science of Joining', Cieslak, Glicksman, Kang and Perepezko eds., TMS Publications, pp. 191-200 (1992).
2. Akay, H. U.,Tong, Y. and Paydar, N., 'Thermal Fatigue Analysis of an SMT Solder Joint Using a Nonlinear FEM Approach', Journal of Microcircuits and Electronic Packaging, Vol. 16, pp. 79-88 (1993).
3. Pan, T.-Y. and Winterbottom, W. L., 'Thermal Cycling Induced Plastic Deformation in Solder Joints', ASME Winter Annual Meeting, Dallas, TX (1990).
4. Hacke, P., Sprecher, A. F. and Conrad, H., 'Computer Simulation of Thermomechanical Fatigue of Solder Joints Including Microstructure Coarsening', Journal of Electronic Packaging, Vol. 115, pp. 153-158 (1993).
5. Busso, E. P., Kitano, M. and Kumazawa, T., 'Modeling Complex Inelastic Deformation Processes in IC Packages' Solder Joints', Journal of Electronic Packaging, Vol. 116, pp. 6-15 (1994).
6. Guo, Q., Cutiongco, E. C., Keer, L. M., and Fine, M. E., 'Thermomechanical Fatigue Life Prediction of 63Sn-37pb Solder', Journal of Electronic Packaging, Vol. 114, pp. 145-151 (1992).
7. 7(a) Sandstrom, R., Osterberg, J,-O. and Nylen, M., 'Deformation Behavior During Low Cycle Fatigue Testing of 60Sn-40Pb Solder', Materials Science and Technology, Vol. 9, pp 811-819 (1993).
8. 7(b) Frear, D. R., 'Thermomechanical Fatigue of Solder Joints: A New Comprehensive Test Method', IEEE Componenst Hybrids, and Manufacturing Technology, Vol. CHMT-12, pp. 492-501 (1989).
9. Frear, D. R., Rashid, M. M. and Burchen, S. N., 'Microstructurally Based Thermomechanical Fatigue Lifetime Model of Solder Joints for Electronic Applications', Reliability, Stress Analysis and Failure Prevention, DE-Vol. 55, ASME, R. J. Schaller, ed., pp. 277-287 (1993).
10. Miller, A., 'An Inelastic Constitutive Model for Monotonic, Cyclic and Creep Deformation: Prtn I - Equations Development and Analytical Procedures', Journal of Engineering Materials Technology, Vol. 98 (1976).
11. Stone, D. S. and Rashid, M. M., 'Constitutive Models', in 'The Mechanics of Solder Alloy Interconnects', Frear, Morgan, Burchett, and Lau, eds., Van Nostrand Reinhold (1994).
12. Clark, M. A. and Alden, T. H., 'Deformation Enhanced Grain Growth in a Superplastic Sn-1% Bi Alloy', Acta Metallurgica, Vol. 21, pp. 1195-1206 (1973).