Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates

Journal of Electronic Materials

Volumn 33, Issue 12, 2004, Pages 1581-1588

  Korhonen, Tia Marje K ^a   Turpeinen, Pekka ^a   Lehman, Lawrence P ^b   Bowman, Brian ^a   Thiel, George H ^c   Parkes, Raymond C ^c   Korhonen, Matt A ^a   Henderson, Donald W ^c   Puttlitz, Karl J ^c  

^a School of Chemical and Molecular Engineering   (United States)

^b State University of New York at Binghamton   (United States)

^c IBM   (United States)

Author keywords

Cooling rate; Lead free solders; Mechanical properties; Micromechanical tests; Solidification; Stress relaxation data

Indexed keywords

COOLING; MECHANICAL PROPERTIES; SOLIDIFICATION; STRAIN RATE; STRESS RELAXATION; THERMAL EFFECTS; TIN ALLOYS; TOXICITY;

COOLING RATE; LEAD FREE SOLDERS; MICROMECHANICAL TESTS; STRESS RELAXATION DATA;

EUTECTICS;

EID: 11344269855     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0101-2     Document Type: Conference Paper

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