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Volumn 33, Issue 12, 2004, Pages 1581-1588

Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates

Author keywords

Cooling rate; Lead free solders; Mechanical properties; Micromechanical tests; Solidification; Stress relaxation data

Indexed keywords

COOLING; MECHANICAL PROPERTIES; SOLIDIFICATION; STRAIN RATE; STRESS RELAXATION; THERMAL EFFECTS; TIN ALLOYS; TOXICITY;

EID: 11344269855     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0101-2     Document Type: Conference Paper
Times cited : (22)

References (12)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.