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Volumn 33, Issue 12, 2004, Pages 1581-1588
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Mechanical properties of near-eutectic Sn-Ag-Cu alloy over a wide range of temperatures and strain rates
c
IBM
(United States)
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Author keywords
Cooling rate; Lead free solders; Mechanical properties; Micromechanical tests; Solidification; Stress relaxation data
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Indexed keywords
COOLING;
MECHANICAL PROPERTIES;
SOLIDIFICATION;
STRAIN RATE;
STRESS RELAXATION;
THERMAL EFFECTS;
TIN ALLOYS;
TOXICITY;
COOLING RATE;
LEAD FREE SOLDERS;
MICROMECHANICAL TESTS;
STRESS RELAXATION DATA;
EUTECTICS;
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EID: 11344269855
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-004-0101-2 Document Type: Conference Paper |
Times cited : (22)
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References (12)
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