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Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 27, Issue 4, 2009, Pages 1861-1864

Lift-off process using bilayer ultraviolet nanoimprint lithography and methacryloxypropyl-terminated-polydimethylsiloxane-based imprint resin

(4) Jung, Ho Yong a Hwang, Seon Yong a Bae, Byeong Ju a Lee, Heon a

a Korea University (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BI-LAYER; ETCH RESISTANCE; HIGH ASPECT RATIO; HIGH FIDELITY; LIFT-OFF PROCESS; LIQUID PHASE; METAL PATTERNS; NANO-SIZED; PATTERN PROFILE; RESIST PATTERN; SHAPED DEFECTS; SIZE AND SHAPE; ULTRAVIOLET-NANOIMPRINT LITHOGRAPHY; UNDERLAYERS; UV CURABLE;

ASPECT RATIO; CURING; MICROCHANNELS; PHOTORESISTS; REACTIVE ION ETCHING; RESINS; SILICONES;

NANOIMPRINT LITHOGRAPHY;

EID: 68349144889 PISSN: 10711023 EISSN: None Source Type: Journal
DOI: 10.1116/1.3156739 Document Type: Article

Times cited : (10)

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