SCOPUS 정보 검색 플랫폼

Volumn 95, Issue 3, 2002, Pages 254-262

Intermetallic compounds formation at interface between PBGA solder ball and Au/Ni/Cu/BT PCB substrate after laser reflow processes

(5) Tian, Yanhong a Wang, Chunqing a Ge, Xiushan a Liu, Peter b Liu, Deming b

a HARBIN INSTITUTE OF TECHNOLOGY (China)

b 5 F Watson Centre (Hong Kong)

Author keywords

Infrared reflow; Intermetallic compounds; Laser reflow

Indexed keywords

COMPUTER SIMULATION; CORRELATION METHODS; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); METALLIZING; MICROSTRUCTURE; SHEAR STRENGTH; SOLDERED JOINTS; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS;

LASER REFLOW PROCESSES;

INTERMETALLICS;

EID: 0036723548 PISSN: 09215107 EISSN: None Source Type: Journal
DOI: 10.1016/S0921-5107(02)00270-2 Document Type: Article

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.