Development of semi-empirical formulation for extracting materials properties from nanoindentation measurements: Residual stresses, substrate effect, and creep

Thin Solid Films

Volumn 516, Issue 8, 2008, Pages 1931-1940

  Chen, Kuo Shen ^a   Chen, Tuo Cheng ^a   Ou, Kuang Shun ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Creep; Dimensional analysis; Finite element analysis; Nanoindentation; Residual stress; Substrate effect

Indexed keywords

CREEP; DIELECTRIC MATERIALS; ELASTIC MODULI; FINITE ELEMENT METHOD; MATERIALS PROPERTIES; NANOINDENTATION; RESIDUAL STRESSES; THIN FILMS;

DIMENSIONAL ANALYSIS; SUBSTRATE EFFECTS;

NANOSTRUCTURED MATERIALS;

EID: 38649131779     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.09.005     Document Type: Article

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