An assessment of immersion silver surface finish for lead-free electronics

Journal of Electronic Materials

Volumn 38, Issue 6, 2009, Pages 815-827

  Wang, Weiqiang ^a,b   Choubey, Anupam ^a   Azarian, Michael H ^a   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Circuit board; Immersion silver; Lead free; Surface finish

Indexed keywords

CIRCUIT BOARD; CIRCUIT BOARDS; EASE OF USE; ELECTROLESS NICKEL IMMERSION GOLD; ELECTRONIC ASSEMBLIES; IMMERSION SILVER; IMMERSION TINS; LEAD FREE ELECTRONICS; LEAD-FREE; ORGANIC SOLDERABILITY PRESERVATIVE; SHELF LIFE; SOLDER-JOINT STRENGTH; SOLDERABILITY; SURFACE FINISH; VOID FORMATION;

INTERMETALLICS; SILVER; SOLDERING ALLOYS; TIN;

LEAD;

EID: 67650395556     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-009-0761-z     Document Type: Conference Paper

References (60)

1. H. Tanaka M. Tanimoto A. Matsuda T. Uno M. Kurihara S. Shiga 1999 J. Electron. Mater. 28 1216 10.1007/s11664-999-0160-5
2. Ganesan S. and Pecht M., "Lead-Free Electronics," John Wiley and Sons, Inc., New York, (2006)
3. P. Vianco 1998 Circuit World 25 6 10.1108/03056129910244518
4. D. Walsh G. Milad D. Gudeczauskas 2006 Print. Circuit Des. Manuf. 23 38
5. C. Melton H. Fuerhaupter 1997 Circuit World 23 30 10.1108/ 03056129710370169
6. D. Bernard and K. Bryant, SMTA International Conference (26 September 2005)
7. R. Kellner 2004 Circuit World 30 30 10.1108/03056120410512208
8. United States Environmental Protection Agency, Technical Report, EPA-744-R-01-001 (US EPA, Washington, DC, June 2001), 43 pp
9. United States Environmental Protection Agency, Technical Report, EPA-744-R-00-002 (US EPA, Washington, DC, March 2000), 49 pp
10. V. Eveloy S. Ganesan Y. Fukuda J. Wu M. Pecht 2005 IEEE Trans. Compon. Packag. Technol. 28 884 10.1109/TCAPT.2005.859353
11. Z. Mei, P. Johnson, M. Kaufmann, and A. Eslambolchi, Proceedings of the IEEE 49th Electronic Components and Technology Conference (San Diego, CA, June 1999), p. 125
12. M. Goosey 2002 Circuit World 23 36 10.1108/03056120310418475
13. Nasser K., Electroplating: Basic Principles, Processes and Practice, Elsevier Advanced Technology, Oxford (2004)
14. M. Barbetta 2004 Print. Circuit Des. Manuf. 21 34
15. D. Goyal, T. Lane, P. Kinzie, C. Panichas, K. Chong, and O. Villalobos, Proceedings of the IEEE 52nd Electronic Components and Technology Conference (San Diego, CA, 28-31 May 2002), p. 732
16. Z. Mei, M. Kaufmann, A. Eslambolchi, and P. Johnson, Proceedings of the IEEE Electronic Components and Technology Conference (Seattle, WA, 25-28 May 1998), p. 952
17. K. Zeng K.N. Tu 2002 Mater. Sci. Eng. Rep. 38 55 10.1016/S0927-796X(02) 00007-4
18. Z. Mei A. Eslambolchi 1999 Circuit World 25 18 10.1108/03056129910258252
19. E.H. Saarivirta 2002 Surf. Coat. Technol. 160 288 10.1016/S0257-8972(02) 00412-7
20. Z. Kovac K.N. Tu 1984 IBM J. Res. Dev. 28 726
21. J. Fang D. Chan 2007 Circuit World 33 43 10.1108/03056120710750940
22. T. Fang M. Osterman S. Mathew M. Pecht 2006 Circuit World 32 25 10.1108/03056120610663371
23. M. Barsoum E. Hoffman R. Doherty S. Gupta A. Zavaliangos 2004 Phys. Rev. Lett. 93 206104-1 10.1103/PhysRevLett.93.206104
24. U. Ray I. Artaki H.M. Gordon P.T. Vianco 1994 J. Electron. Mater. 23 779 10.1007/BF02651373
25. U. Ray I. Artaki P.T. Vianco 1995 IEEE Trans. Compon. Packag. Manuf. Technol. A 18 153
26. Thierauf S.C., "High-Speed Circuit Board Signal Integrity," Artech House Inc., Norwood, MA (2004)
27. D. Cullen, B. Kline, G. Moderhock, and G. Larry (Presented at the IPC Expo, April 2001)
28. X. Wu D. Cullen G. Brist O. Ramahi 2008 IEEE Trans. Adv. Packag. 31 182 10.1109/TADVP.2007.914962
29. G. Chou and R. Hilty, Proceedings of the IPC Annual Meeting (Minneapolis, MN, 28 September-2 October 2003), p. s07-2-1
30. N. Corman, M. Myers, and C. Copper, Proceedings of the IEEE 49th Holm Conference on Electrical Contacts (Washington D.C., 8-10 September 2003), p. 38
31. IPC Standard 4553, Specification for Immersion Silver Plating for Printed Circuit Boards (February 2005)
32. E. Lopez P. Vianco R. Buttry S. Lucero J. Rejent 2005 SMTA J. 18 19
33. M. Arra D. Shangguan D. Xie J. Sundelin T. Lepisto E. Ristolainen 2004 J. Electron. Mater. 33 977 10.1007/s11664-004-0025-x
34. S. Sattiraju, R. Johnson, D. Genc, and M. Bozack, Proceedings of the IEEE International Electronics Manufacturing Technology Symposium (Santa Clara, CA, 2000), p. 253
35. S. Sattiraju B. Dang R. Johnson Y. Li J. Smith M. Bozack 2002 IEEE Trans. Electron. Packag. Manuf. 25 168 10.1109/TEPM.2002.801651
36. Circuit Card Assembly and Materials Task Force (CCAMTF), Report-Screening Test Results for Developing Guidelines for Conformal Coating Usage and Evaluation Alternative Surface Finishes (April 1997), p. 63.
37. P. Vianco, E. Lopez, R. Buttry, A. Kilgo, and S. Lucero (Presented at the Pan Pacific Microelectronics Symposium & Exhibit (Hawaii, 17-19 January 2006)
38. E. Lopez, P. Vianco, S. Lucero, W. Buttry, J. Rejent, and J. Martin, Proceedings of the 3rd International Brazing and Soldering Conference (San Antonio, TX, 23-26 April 2006), p. 93
39. W. Abbott 1988 IEEE Trans. Compon. Hybrids Manuf. Technol. 11 22
40. Wassink R., and Klein J. (1984) Soldering in Electronics. Electrochemical Publications Limited, Ayr, Scotland
41. S. Lamprecht, L. Schreier, and R. Vogel, SMTA International Conference (22 September 2002)
42. B. Reagor J. Sinclair 1981 J. Electrochem. Soc. 128 701 10.1149/1.2127485
43. E. Norwood and J. Swanson, SMTA International Conference (25 September 2005)
44. T.E. Graedel 1992 J. Electrochem. Soc. 139 1963 10.1149/1.2221162
45. P. Mazurkiewicz, Proceedings of the 32nd International Symposium for Testing and Failure Analysis (Austin, TX, 12-16 November 2006), p. 469
46. R. Schueller (Presented at the IPC and JEDEC International Conference on Lead-Free Electronics, Austin, TX, 3-5 December 2007)
47. R. Veale, SMTA International Conference (25 September 2005)
48. Instrument Society of America, ISA-71.04, Environmental Conditions for Process Measurement and Control Systems: Airborne Contaminants (Instrument Society of America, Research Triangle Park, NC, 1985)
49. Association Connecting Electronics Industries, IPC-B-25-2, Multipurpose Two-sided Test Pattern (Association Connecting Electronics Industries, Bannockburn, IL, 2000)
50. C. Xu, K. Fleming, G. Derkits, J. Franey, and W. Reents, Proceedings of the IPC Printed Circuits Expo, APEX (Los Angles, CA, 20-22 February 2007)
51. D. Cullen and G. O'Brien, IPC Printed Circuits Expo, SMEAM Council Apex, Designers Summit, pp. S10-5-1-S10-5-10
52. S. Zhan M. Azarian M. Pecht 2006 IEEE Trans. Electron. Packag. Manuf. 29 217 10.1109/TEPM.2006.882496
53. S. Zhan, M. Azarian, and M. Pecht, Proceedings of the 38th International Symposium on Microelectronics (Philadelphia, PA, 25-29 September 2005), p. 367
54. Association Connecting Electronics Industries, IPC-TM-650, Method 2.6.3.3, Surface Insulation Resistance, Fluxes (Association Connecting Electronics Industries, Bannockburn, IL, June 2004)
55. Association Connecting Electronics Industries, IPC J-STD-004, Requirements for Soldering Fluxes (Association Connecting Electronics Industries, Bannockburn, IL, January 2004)
56. F. Houghton, Proceedings of the Technical Conference - IPC Expo (March 1997), p. s16-4-1
57. J. Yoon J. Lim H. Lee J. Joo S. Jung 2006 J. Mater. Res. 21 3196 10.1557/jmr.2006.0390
58. Y. Zheng, C. Hillman, and P. McCluskey, Proceedings of the 52nd IEEE Electronic Components and Technology Conference (San Diego, CA, 28-31 May 2002), p. 1226
59. A. Spowage C. Thong P. Collier 2004 Int. J. Nanosci. 3 803 10.1142/S0219581X04002607
60. C. Tz-Cheng, K. Zeng, R. Stierman, D. Edwards, and K. Ano, Proceedings of the IEEE 54th Electronic Components and Technology Conference (1-4 June 2004), p. 1256