Interfacial reactions and joint strength of Sn-37Pb and Sn-3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C

Journal of Materials Research

Volumn 21, Issue 12, 2006, Pages 3196-3204

  Yoon, Jeong Won ^a   Lim, Jun Hyung ^a   Lee, Hoo Jeong ^a   Joo, Jinho ^a   Jung, Seung Boo ^a   Moon, Won Chul ^a  

^a Sungkyunkwan University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; BRITTLENESS; COPPER; EUTECTICS; INTERFACES (MATERIALS); SILVER PLATING; SOLDERED JOINTS; SUBSTRATES; SURFACE REACTIONS;

BULK SOLDER; IMMERSION; MECHANICAL RELIABILITY;

SOLDERING ALLOYS;

EID: 33846332373     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2006.0390     Document Type: Article

References (22)

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