Reliability issues of no-clean flux technology with lead-free solder alloy for high density printed circuit boards

Proceedings - 2005 International Symposium on Microelectronics, IMAPS 2005

Volumn , Issue , 2005, Pages 367-375

  Zhan, Sheng ^a   Azarian, Michael H ^a   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

High density printed circuit board and lead free solder; No clean flux; Reliability

Indexed keywords

ACCELERATED TEST METHODS; COMPARATIVE ASSESSMENT; ELECTROCHEMICAL MIGRATION; LEAD FREE SOLDERS; NO-CLEAN FLUXES; SURFACE INSULATION RESISTANCES; TEMPERATURE AND HUMIDITIES; TIN-SILVER-COPPER ALLOYS;

MATERIALS TESTING; MICROELECTRONICS; RELIABILITY; TIN;

PRINTED CIRCUIT BOARDS;

EID: 84876929082     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. IPC Publication IPC-TR-476A, "Electrochemical Migration: Electrically Induced Failures in Printed Wiring Assemblies", Northbrook, IL, May 1997.
2. J. Jachim, G. Freeman and L. Turbini, "Use of surface insulation resistance and contact angle measurements to characterize the interactions of three water soluble fluxes with FR-4 substrates," IEEE Transactions on Components, Packaging, and Manufacturing Technology, Volume 20, Issue 4, Nov. 1997 Page(s): 443-451.
3. K. Rogers, C. Hillman, M. Pecht and S. Nachbor, "Conductive Filament Formation Failure in a Printed Circuit Board, T" Circuit World, Vol. 25 (3), pp. 6-8, 1999.
4. M. Pecht, K. Rogers and C. Hillman, "Hollow Fibers can Accelerate Conductive Filament Formation," ASM International Practical Failure Analysis, pp. 57-60, Vol. 1, Issue 4, August 2001.
5. W. Jud Ready and L. Turbini, "A Comparison of Hourly Versus Daily Testing Method for Evaluating the Reliability of Water Soluble Fluxes," IEEE Transactions on Advanced Packaging, Vol. 23, No. 2, May 2000.
6. IPC-TM-650, Method 2.6.3.3, "Surface Insulation Resistance, Fluxes", June 2004.
7. DIN IEC Publication IEC 61189-5-draft, "Draft Document - Test Method for Electrical Materials, Interconnection Structures and Assemblies - Part 5: Test Method for Printed Board Assemblies," Nov 2002.
8. J-STD-004, "Requirements for Soldering Fluxes", Jan 2004.
9. M. Pecht, H. Ardebilib, A. Shukla, J. Hagge, and D. Jennings, "Moisture Ingress into Organic Laminates," IEEE Transactions on Components and Packaging Technology, Vol. 22, No. 1, pp. 104-110, March 1999.
10. M. Pecht, E. Bumiller, D. Douthit and J. Pecht, "Contamination of Electronic Assemblies", CRC PRESS, 2003.