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Volumn 28, Issue 3, 2002, Pages 36-39
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Factors influencing the formation of "black pad" in electroless nickel-immersion gold solderable finishes - a processing perspective
a
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Author keywords
Electronics assembly; Surface films
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Indexed keywords
DISCOLORATION;
FRACTURE;
GOLD;
INTERFACES (MATERIALS);
METALLIZING;
NICKEL;
ORGANIC COATINGS;
PRINTED CIRCUIT MANUFACTURE;
SOLDERED JOINTS;
SOLDERING;
SUBSTRATES;
SURFACE MOUNT TECHNOLOGY;
BLACK PAD;
HOT AIR SOLDER LEVELLED;
INTERMETALLIC FORMATION;
ORGANIC SOLDERABILITY PRESERVATIVES;
SURFACE FILMS;
PRINTED CIRCUIT BOARDS;
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EID: 0036076079
PISSN: 03056120
EISSN: None
Source Type: Journal
DOI: 10.1108/03056120310418475 Document Type: Article |
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Times cited : (16)
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References (5)
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