Effect of surface finishes on the thickness and morphology of the intermetallic layer in lead-free solder joints

International Journal of Nanoscience

Volumn 3, Issue 6, 2004, Pages 803-813

  Spowage, A C ^a   Thong, C M ^a   Collier, P A ^a   Li, G Y ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Finishes; Layer thickness; Lead free solder; Nanometer intermetallics; SEM

Indexed keywords

FINISHES; LAYER THICKNESS; LEAD-FREE SOLDER; NANOMETER INTERMETALLICS;

ENERGY DISPERSIVE SPECTROSCOPY; GROWTH (MATERIALS); INTERMETALLICS; LEAD; MORPHOLOGY; NANOSTRUCTURED MATERIALS; PRINTED CIRCUIT BOARDS; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

SOLDERED JOINTS;

EID: 21144450066     PISSN: 0219581X     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0219581X04002607     Document Type: Article

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