Pb-free surface-finishing on electronic components' terminals for Pb-free soldering assembly

Journal of Electronic Materials

Volumn 28, Issue 11, 1999, Pages 1216-1223

  Tanaka, Hitoshi ^a   Tanimoto, Morimasa ^a   Matsuda, Akira ^a   Uno, Takeo ^a   Kurihara, Masaaki ^a   Shiga, Shoji ^a  

^a FURUKAWA ELECTRIC CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BINARY ALLOYS; BRITTLENESS; CRYSTAL DEFECTS; HEAT RESISTANCE; INTEGRATED CIRCUIT MANUFACTURE; LEAD; METAL FINISHING; MULTILAYERS; NICKEL; SOLDERING ALLOYS; SUBSTRATES; TIN ALLOYS;

LEAD-FREE SURFACE FINISHING;

ELECTRONICS PACKAGING;

EID: 0033221822     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0160-5     Document Type: Article

References (5)

1. T. Suga, Int. Packaging Strategy Symp. 98 Proc. (Mountain View, CA: SEMI, 1998), p. 98.
2. Lead-Free Solder Project Final Report (Ann Arbor, MI: National Center of Manufacturing Sciences, 1997).
3. F. Hua, Z. Mei, and J. Glazer, 1998 Electronic Components and Technology Conf., (Piscataway, NJ: IEEE, 1998), p. 277.
4. M. Mori, T. Tani, M. Kurihara, T. Uno, and T. Morikawa, Furakawa Review 17, 89 (1998).
5. T. Uno ,M. Kurihara, T. Tani, M. Mori, and T. Morikawa, J. Japan Copper & Brass Res. Assoc. 36, 94 (1997).