Open forum: Are you ready for lead-free electronics?

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 4, 2005, Pages 884-894

  Eveloy, Valérie ^a   Ganesan, Sanka ^a   Fukuda, Yuki ^a   Wu, Ji ^a   Pecht, Michael G ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Lead free; RoHS; Tin lead soldering

Indexed keywords

CHEMICAL ANALYSIS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; LAMINATES; MOISTURE; PRINTED CIRCUIT BOARDS; RELIABILITY; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS;

COMPONENT TERMINATION METALLURGIES; LEAD-FREE ELECTRONICS; LEAD-FREE TRANSITION PROCESS; THERMAL SENSITIVITY;

CONSUMER ELECTRONICS;

EID: 29244480314     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.859353     Document Type: Review

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