Surface insulation resistance of conformally coated printed circuit boards processed with no-clean flux

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 29, Issue 3, 2006, Pages 217-223

  Zhan, Sheng ^a   Azarian, Michael H ^a   Pecht, Michael G ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

Accelerated testing; Conformal coating; Contamination; Dendrite; Electrochemical migration; Filament; No clean flux; Reliability; Surface insulation resistance; Temperature humidity bias (THB)

Indexed keywords

COATINGS; CONTAMINATION; ELECTROMIGRATION; INSULATION;

CONDUCTOR SPACING; CONFORMAL COATING; ELECTROCHEMICAL MIGRATION; NO-CLEAN FLUX; SURFACE INSULATION RESISTANCE; TEMPERATURE-HUMIDITY BIAS;

PRINTED CIRCUIT BOARDS;

EID: 33750126884     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2006.882496     Document Type: Article

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