Tin whisker risk assessment

Circuit World

Volumn 32, Issue 3, 2006, Pages 25-29

  Fang, Tong ^a,b   Osterman, Michael ^a   Mathew, Sony ^a   Pecht, Michael ^a  

^a UNIVERSITY OF MARYLAND   (United States)

^b Vitesse Semiconductor Corporation   (United States)

Author keywords

Algorithmic languages; Printed circuits; Risk assessment; Tin lead

Indexed keywords

ALGORITHMS; CRYSTAL GROWTH; CRYSTAL WHISKERS; FAILURE (MECHANICAL); RISK ASSESSMENT; SEMICONDUCTING TIN COMPOUNDS;

GROWTH RATES; TIN WHISKER; WHISKER GROWTH; WHISKER RISK;

PRINTED CIRCUIT BOARDS;

EID: 33748298817     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120610663371     Document Type: Article

References (11)

1. Brusse, J. (2002), "Tin whisker observations on pure tin-plated ceramic chip capacitors", AESF SUR/FIN Proceedings, June 24-27.
2. European Union (2002), "Directive 2002/96/EC of the European parliament and of the council of 27 January 2003 on waste electrical and electronic equipment (WEEE)", Official Journal of the European Union, pp. L37/24-38.
3. Fang, T., Osterman, M. and Pecht, M. (2006), "Statistical analysis of tin whisker growth", Microelectronics Reliability, Vol. 46 Nos 5-6, pp. 846-9.
4. Fukuda, Y. (2005), Experimental Investigation of Whisker Formation on Tin Platings, PhD thesis, University of Maryland, College Park, MD, October 2005.
5. Ganesan, S. and Pecht, M. (2004), Lead-free Electronics, CALCE EPSC Press, University of Maryland, College Park, MD.
6. JEDEC Standard JESD22A121 (2005), "Measuring whisker growth on tin and tin alloy surface finishes", JEDEC Solid State Technology Association, Arlington, VA, May.
7. Lee, B.Z. and Lee, D.N. (1998), "Spontaneous growth mechanism of tin whiskers", Acta Materials, Vol. 46 No. 10, pp. 3701-14.
8. Okada, S., Higuchi, S. and Ando, T. (2003), Field Reliability Estimation of Tin Whiskers Generated by Thermal-Cycling Stress, Murata Manufacturing Corporation, Ltd.
9. Pecht, M., Fukuda, Y. and Rajagopal, S. (2004), "The impact of lead-free legislation exemptions on the electronics industry", IEEE Transactions on Electronics Packaging Manufacturing, Vol. 27 No. 4.
10. Pinsky, D., Osterman, M. and Ganesan, S. (2004), "Tin whiskering risk factors", IEEE Transactions on Components and Packaging Technologies, Vol. 27 No. 2, pp. 427-31.
11. Xu, C., Zhang, Y., Fan, C. and Abys, J. (2002), "Understanding whisker phenomenon: The driving force for whisker formation", CircuiTree, pp. 10-21.