Surface finish effects on high-speed signal degradation

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 1, 2008, Pages 182-189

  Wu, Xin ^a   Cullen, Don ^b   Brist, Gary ^c   Ramahi, Omar M ^d  

^a ANSYS INC   (United States)

^b MacDermid Incorporated   (United States)

^c INTEL CORPORATION   (United States)

^d UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Interconnect; Signal degradation; Signal integrity; Surface finish

Indexed keywords

DIELECTRIC PROPERTIES; ELECTRIC CONDUCTIVITY; FINISHING; FINITE ELEMENT METHOD; MICROSTRIP LINES; MICROWAVE FREQUENCIES; SKIN EFFECT;

HOT AIR SOLDER LEVELING; SIGNAL DEGRADATION; SIGNAL INTEGRITY;

SIGNAL DISTORTION;

EID: 40549117904     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2007.914962     Document Type: Article

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