Lead-free tin surface finish for PCB assembly

Circuit World

Volumn 23, Issue 2, 1997, Pages 30-31

  Melton, C ^a   Fuerhaupter, H ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; BISMUTH METALLURGY; ELECTROPLATING; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY; THIN FILMS; TIN METALLURGY;

BOND PADS; ELECTRICAL TEST PROBES; LEAD FREE TIN SURFACE FINISH; PRINTED CIRCUIT BOARD ASSEMBLY; SOLDERABILITY;

PRINTED CIRCUIT MANUFACTURE;

EID: 0030736309     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056129710370169     Document Type: Article

References (4)