In situ stress evolution during and after sputter deposition of Al thin films

Journal of Physics Condensed Matter

Volumn 21, Issue 22, 2009, Pages

  Pletea, M ^a   Koch, R ^b   Wendrock, H ^c   Kaltofen, R ^a   Schmidt, O G ^a  

^a IFW DRESDEN   (Germany)

^b JOHANNES KEPLER UNIVERSITY LINZ   (Austria)

^c Institute for Complex Materials   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ADATOM MOBILITIES; AL THIN FILMS; BEAM DEFLECTION; CONSTANT RATE; DEPOSITED FILMS; DEPOSITION OF FILMS; ELECTRICAL RESISTIVITY; FILM DEPOSITION; IN-SITU; INSITU STRESS; MASS DENSITIES; MORPHOLOGY EVOLUTION; POROUS MICROSTRUCTURE; SI (100) SUBSTRATE; SPUTTER PRESSURE; STRESS EVOLUTION; STRESS GENERATION; STRESS MECHANISMS; SUBSTRATE CURVATURE; THERMALLY OXIDIZED; VOLMER-WEBER GROWTH MODE;

ALUMINUM; ATOMIC FORCE MICROSCOPY; ELECTRIC RESISTANCE; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SOLID STATE LASERS; TENSILE STRESS; THIN FILMS;

SUBSTRATES;

EID: 66349113414     PISSN: 09538984     EISSN: 1361648X     Source Type: Journal    
DOI: 10.1088/0953-8984/21/22/225008     Document Type: Article

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