Ultra high-cycle fatigue in pure Al thin films and line structures

Materials Science and Engineering: A

Volumn 421, Issue 1-2, 2006, Pages 68-76

  Eberl, C ^a   Spolenak, R ^b   Arzt, E ^a,b   Kubat, F ^c   Leidl, A ^c   Ruile, W ^c   Kraft, O ^d  

^a UNIVERSITY OF STUTTGART   (Germany)

^b MAX PLANCK INSTITUTE FOR INTELLIGENT SYSTEMS   (Germany)

^c EPCOS AG   (Germany)

^d KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

Al thin films; Fatigue; Finite element analysis

Indexed keywords

CORRELATION METHODS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; METAL EXTRUSION; STRESS CONCENTRATION; THIN FILMS;

ALUMINUM THIN FILMS; LINE STRUCTURES; QUALITATIVE MICROSTRUCTURAL ANALYSIS; QUANTITATIVE POST-TEST ANALYSIS;

ALUMINUM;

ALUMINUM; CORRELATION METHODS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; METAL EXTRUSION; STRESS CONCENTRATION; THIN FILMS;

EID: 33645987564     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2005.10.007     Document Type: Article

References (28)

1. White R.M., and Voltmer F.W. Appl. Phys. L (1965) 314
2. Latham J.I., Shreve W.R., Tolar N.J., and Ghate P.B. Thin Solid Films 64 (1979) 9
3. Shibagaki N., Asai K., Tabuchi T., Hirashima T., and Hikita M. IEEE-Ultrasonics Symp. (1991) 439
4. S. Menzel, H. Schmidt, M. Weihnacht, K. Wetzig, Stress-Induced Phenomena in Metallization AIP (2002) 133.
5. Kimura N., Nakano M., and Sato K. Jpn. J. Appl. Phys. 37 (1998) 1017
6. Kimura N., Nakano M., Nakazawa M., and Sato K. Jpn. J. Appl. Phys. 36 (1997) 3101
7. Ota Y., and Yuhara A. Jpn. J. Appl. Phys. 34 (1995) 2693
8. Sakurai A., Nakanishi H., and Yoshino Y. Jpn. J. Appl. Phys. 34 (1995) 2674
9. Sakurai A., Yoshino Y., and Ieki H. Jpn. J. Appl. Phys. 33 (1994) 3015
10. Nishihara T., Uchishiba H., Ikata O., and Sato Y. Jpn. J. Appl. Phys. 34 (1995) 2688
11. R. Takayama, H. Nakanishi, T. Sakuragawa, T. Kawasaki, K. Nomura, IEEE Ultrasonics Symp., San Juan, 2000 (preprint).
12. R. Takayama, M. Furukawa, Y. Murashima, T. Sakuragawa, N. Yuda, K. Nomura, IEEE Ultrasonics Symp., Japan, 1998 (preprint).
13. Kimura N., Nakano M., and Sato K. IEEE Ultrasonics Symp. (1998) 315
14. W. Ruile, G. Raml, A. Sprinter, R. Weigel, IEEE Ultrasonics Symp., 2000 (preprint).
15. G. Raml, W. Ruile, A. Springer, R. Weigel, IEEE Ultrasonics Symp., 2001 (preprint).
16. Taki K., and Shimizu Y. Jpn. J. Appl. Phys. 33 (1994) 2976
17. Provided by manufacturer.
18. Ghate P.B., Blaire J.C., and Fuller C.R. Thin Solid Films 45 (1977) 69
19. C. Eberl, R. Spolenak, O. Kraft, W. Ruile, E. Arzt,Thin Solid Films, in press.
20. Schwaiger R., and Kraft O. Acta Mater. 51 (2003) 195
21. Nix W.D. Metall. Trans. A 20 A (1989) 2217
22. Zhang G.P., Volkert C.A., Schwaiger R., Arzt E., and Kraft O. J. Mater. Res. 20 (2005) 201
23. Kraft O., Schwaiger R., and Wellner P. Mater. Sci. Eng. A 319-321 (2001) 919
24. Stanzl-Tschegg S.E. Proceedings of the Sixth International Fatigue Congress (1996) 1887
25. Naundorf V., and Lücke K. Fifth International Conference on Internal Friction and Ultrasonic Attenuation in Crystalline Solids II (1975) 281
26. Eiras J.A. J. Alloy Compd. 310 (2000) 68
27. Akune K., Mondino M., and Vittoz B. Fifth International Conference on Internal Friction and Ultrasonic Attenuation in Crystalline Solids II (1975) 211
28. Walcker A., Weygand D., and Kraft O. Mater. Sci. Eng. A 400-401 (2005) 397-400