Stress evolution during and after sputter deposition of thin Cu-Al alloy films

Journal of Physics Condensed Matter

Volumn 20, Issue 25, 2008, Pages

  Pletea, M ^a   Wendrock, H ^a   Kaltofen, R ^a   Schmidt, O G ^a   Koch, R ^b  

^a IFW DRESDEN   (Germany)

^b JOHANNES KEPLER UNIVERSITY LINZ   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

FILM GROWTH; GRAIN GROWTH; SCANNING ELECTRON MICROSCOPY; SPUTTER DEPOSITION; STRESS ANALYSIS; THERMOOXIDATION;

ALLOY FILMS; OXIDIZED SUBSTRATES; STRESS EVOLUTION; SUBSTRATE CURVATURE MEASUREMENTS;

BINARY ALLOYS;

EID: 44649098296     PISSN: 09538984     EISSN: 1361648X     Source Type: Journal    
DOI: 10.1088/0953-8984/20/25/255215     Document Type: Article

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